Modular Integration Platform for Printed Electronics

Seiya Ono

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2020-156
August 13, 2020

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-156.pdf

The field of flexible and printed electronics has been on the rise, with an increasing demand for low cost, physically robust, conformal sensors and devices to be used in a variety of applications in the age of edge computing. It would be unreasonable, however, to expect all of these flexible organic electronics to perform at remotely similar orders of magnitude with respect to solid state electronics - this introduces a need for flexible hybrid electronics that integrate the speed and power efficiency of solid state electronics with flexible, printed electronics to occupy the middle ground between the two.

The development of flushed out hybrid electronics systems is often seen to be the end goal, utilizing new, ground breaking fabrication technology to make new sensors, in conjunction with high performance, solid state electronics for small form factor, well packaged final products. While this does make for very beautiful end products, the amount of prototyping and research effort put into making the flexible electronics interface, the data collection, the enclosure, and every perfectly tuned parameter is something that becomes very repetitive, akin to "reinventing the wheel".

I propose that a modular design approach could help alleviate much of the repetitive aspects pertaining to the prototyping efforts in flexible hybrid electronics. I will present my new integration tool, the Modular Integration Platform for Printed Electronics (MIPPE), and demonstrate the effectiveness of a modular approach to design through the use of the various platforms for development available in MIPPE and some of its example use cases. By distilling the most common variations of flexible electronic interfaces into interchangeable, reusable hardware blocks, the R&D time would be reduced, increasing research productivity in the field of flexible and printed electronics.

Advisor: Ana Claudia Arias


BibTeX citation:

@mastersthesis{Ono:EECS-2020-156,
    Author = {Ono, Seiya},
    Editor = {Arias, Ana Claudia and Dutta, Prabal},
    Title = {Modular Integration Platform for Printed Electronics},
    School = {EECS Department, University of California, Berkeley},
    Year = {2020},
    Month = {Aug},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-156.html},
    Number = {UCB/EECS-2020-156},
    Abstract = {The field of flexible and printed electronics has been on the rise, with an increasing demand for low cost, physically robust, conformal sensors and devices to be used in a variety of applications in the age of edge computing. It would be unreasonable, however, to expect all of these flexible organic electronics to perform at remotely similar orders of magnitude with respect to solid state electronics - this introduces a need for flexible hybrid electronics that integrate the speed and power efficiency of solid state electronics with flexible, printed electronics to occupy the middle ground between the two.

The development of flushed out hybrid electronics systems is often seen to be the end goal, utilizing new, ground breaking fabrication technology to make new sensors, in conjunction with high performance, solid state electronics for small form factor, well packaged final products. While this does make for very beautiful end products, the amount of prototyping and research effort put into making the flexible electronics interface, the data collection, the enclosure, and every perfectly tuned parameter is something that becomes very repetitive, akin to "reinventing the wheel".

I propose that a modular design approach could help alleviate much of the repetitive aspects pertaining to the prototyping efforts in flexible hybrid electronics. I will present my new integration tool, the Modular Integration Platform for Printed Electronics (MIPPE), and demonstrate the effectiveness of a modular approach to design through the use of the various platforms for development available in MIPPE and some of its example use cases. By distilling the most common variations of flexible electronic interfaces into interchangeable, reusable hardware blocks, the R&D time would be reduced, increasing research productivity in the field of flexible and printed electronics.}
}

EndNote citation:

%0 Thesis
%A Ono, Seiya
%E Arias, Ana Claudia
%E Dutta, Prabal
%T Modular Integration Platform for Printed Electronics
%I EECS Department, University of California, Berkeley
%D 2020
%8 August 13
%@ UCB/EECS-2020-156
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-156.html
%F Ono:EECS-2020-156