Catalog Description: Integrated circuit device fabrication and surface micromachining technology. Thermal oxidation, ion implantation, impurity diffusion, film deposition, expitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.

Units: 4

Also Offered As: ELENG 143

Related Areas:

• Physical Electronics (PHY)

Prerequisites: PHYSICS 7B

Formats:
Fall: 3 hours of lecture and 3 hours of laboratory per week
Spring: 3 hours of lecture and 3 hours of laboratory per week

Grading Basis: Student Option

Final Exam Status: Yes

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Class Schedule (Spring 2026):
EE 143 – TuTh 14:00-15:29, Soda 306 – Ali Javey

Class Notes
Phase 1 and 2 seats are open to ECE, EECS, CS, and non-EECS COE majors. Remaining seats open during the adjustment period.

*To enroll in this class, select the lecture and 999L (placeholder) Lab section. Assignment to the actual lab sections will be managed by teaching staff.*

Class Schedule (Fall 2026):
EE 143 – TuTh 15:30-16:59, The Gateway Building B1022 – Grigory Tikhomirov

Class Notes
Phase 1 and 2 seats are open to EECS, ECE, and CS Majors. Remaining seats open to non-EECS COE during the adjustment period.

Non-COE Majors cannot enroll or waitlist.

Physics 7B or 5B,BL is an enforced prerequisite.

MANDATORY SAFETY TRAINING DURING THE FIRST TWO WEEKS - IF YOU MISS THE TRAINING YOU CANNOT TAKE THE COURSE

Links:

• EECS Course Archives (CalNet authentication required)
• CS enrollment policies
• EE enrollment policies
• HKN course maps