Simulation and Modeling of Evaporated Deposition Profiles
Chiakang Sung
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M81/8
, 1981
http://www2.eecs.berkeley.edu/Pubs/TechRpts/1981/ERL-m-81-8.pdf
This report presents a program for the simulation of metalization. The simulation is used to investigate metal step coverage for a variety of source and substrate configurations. The models used for deposition combine analytic and numerical summations. The deposition rate is derived as an analytic function, and the simulation proceeds by summing the deposition through a series of finite time-steps. Simulations have been made to model metalization over steps with the following source-substrate geometries: (1) unidirectional source, (2) dual evaporation sources, (3) hemispherical vapor source, (4) point sources with planetary-mounted substrate. The modeling technique has also been extended to deposition processes with elevated substrate temperature.
BibTeX citation:
@mastersthesis{Sung:M81/8, Author= {Sung, Chiakang}, Title= {Simulation and Modeling of Evaporated Deposition Profiles}, School= {EECS Department, University of California, Berkeley}, Year= {1981}, Month= {Feb}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/1981/9613.html}, Number= {UCB/ERL M81/8}, Abstract= {This report presents a program for the simulation of metalization. The simulation is used to investigate metal step coverage for a variety of source and substrate configurations. The models used for deposition combine analytic and numerical summations. The deposition rate is derived as an analytic function, and the simulation proceeds by summing the deposition through a series of finite time-steps. Simulations have been made to model metalization over steps with the following source-substrate geometries: (1) unidirectional source, (2) dual evaporation sources, (3) hemispherical vapor source, (4) point sources with planetary-mounted substrate. The modeling technique has also been extended to deposition processes with elevated substrate temperature.}, }
EndNote citation:
%0 Thesis %A Sung, Chiakang %T Simulation and Modeling of Evaporated Deposition Profiles %I EECS Department, University of California, Berkeley %D 1981 %@ UCB/ERL M81/8 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/1981/9613.html %F Sung:M81/8