PANDA: A PLA Generator for Multiply-Folded PLAs
Grace H. Mah
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M84/95
, 1984
http://www2.eecs.berkeley.edu/Pubs/TechRpts/1984/ERL-m-84-95.pdf
PLAs (Programmable Logic Arrays) are regular structures that are important components in large integrated circuits. The regularity in the structure of PLAs allows automatic design and layout. However, simple automatic layout algorithms usually result in circuits with large area. One method of reducing the area occupied by PLAs is to use multiple folding, a technique implemented at Berkeley in a program called PLEASURE. PLEASURE output is in a symbolic format. PANDA (PLA Analyzer and Design Aid) uses a combination of graphic and procedural methods to lay out the masks for multiply-folded PLAs using the personality matrix produced by the PLEASURE program.
BibTeX citation:
@mastersthesis{Mah:M84/95, Author= {Mah, Grace H.}, Title= {PANDA: A PLA Generator for Multiply-Folded PLAs}, School= {EECS Department, University of California, Berkeley}, Year= {1984}, Month= {Apr}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/1984/412.html}, Number= {UCB/ERL M84/95}, Abstract= {PLAs (Programmable Logic Arrays) are regular structures that are important components in large integrated circuits. The regularity in the structure of PLAs allows automatic design and layout. However, simple automatic layout algorithms usually result in circuits with large area. One method of reducing the area occupied by PLAs is to use multiple folding, a technique implemented at Berkeley in a program called PLEASURE. PLEASURE output is in a symbolic format. PANDA (PLA Analyzer and Design Aid) uses a combination of graphic and procedural methods to lay out the masks for multiply-folded PLAs using the personality matrix produced by the PLEASURE program.}, }
EndNote citation:
%0 Thesis %A Mah, Grace H. %T PANDA: A PLA Generator for Multiply-Folded PLAs %I EECS Department, University of California, Berkeley %D 1984 %@ UCB/ERL M84/95 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/1984/412.html %F Mah:M84/95