X.Y. Qian, M.H. Kiang, Nathan W. Cheung, I.G. Brown, X. Godechot, J.E. Galvin, R.A. MacGill and K.M. Yu
EECS Department
University of California, Berkeley
Technical Report No. UCB/ERL M90/82
September 1990
http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/ERL-90-82.pdf
BibTeX citation:
@techreport{Qian:M90/82, Author = {Qian, X.Y. and Kiang, M.H. and Cheung, Nathan W. and Brown, I.G. and Godechot, X. and Galvin, J.E. and MacGill, R.A. and Yu, K.M.}, Title = {Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating}, Institution = {EECS Department, University of California, Berkeley}, Year = {1990}, Month = {Sep}, URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html}, Number = {UCB/ERL M90/82} }
EndNote citation:
%0 Report %A Qian, X.Y. %A Kiang, M.H. %A Cheung, Nathan W. %A Brown, I.G. %A Godechot, X. %A Galvin, J.E. %A MacGill, R.A. %A Yu, K.M. %T Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating %I EECS Department, University of California, Berkeley %D 1990 %@ UCB/ERL M90/82 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html %F Qian:M90/82