Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating

X.Y. Qian and M.H. Kiang and Nathan W. Cheung and I.G. Brown and X. Godechot and J.E. Galvin and R.A. MacGill and K.M. Yu

EECS Department, University of California, Berkeley

Technical Report No. UCB/ERL M90/82

1990

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http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/Archive/ERL-90-82.pdf

BibTeX citation:

@techreport{Qian:M90/82,
    Author= {Qian, X.Y. and Kiang, M.H. and Cheung, Nathan W. and Brown, I.G. and Godechot, X. and Galvin, J.E. and MacGill, R.A. and Yu, K.M.},
    Title= {Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating},
    Year= {1990},
    Month= {Sep},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html},
    Number= {UCB/ERL M90/82},
}

EndNote citation:

%0 Report
%A Qian, X.Y. 
%A Kiang, M.H. 
%A Cheung, Nathan W. 
%A Brown, I.G. 
%A Godechot, X. 
%A Galvin, J.E. 
%A MacGill, R.A. 
%A Yu, K.M. 
%T Metal Vapor Vacuum Arc Ion Implantation for Seeding of Electroless Cu Plating
%I EECS Department, University of California, Berkeley
%D 1990
%@ UCB/ERL M90/82
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/1990/1578.html
%F Qian:M90/82