Modeling and Testing of Electromigration Effects in Integrated Circuit Interconnects and Contacts under Time-Varying Current Conditions
Boon-Khim Liew
EECS Department, University of California, Berkeley
1990
Advisors: Nathan W. Cheung
BibTeX citation:
@phdthesis{Liew:7788, Author= {Liew, Boon-Khim}, Title= {Modeling and Testing of Electromigration Effects in Integrated Circuit Interconnects and Contacts under Time-Varying Current Conditions}, School= {EECS Department, University of California, Berkeley}, Year= {1990}, }
EndNote citation:
%0 Thesis %A Liew, Boon-Khim %T Modeling and Testing of Electromigration Effects in Integrated Circuit Interconnects and Contacts under Time-Varying Current Conditions %I EECS Department, University of California, Berkeley %D 1990 %F Liew:7788