Full profile chemical mechanical polishing (CMP) metrology
Runzi Chang
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M01/23
2001
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-23.pdf
BibTeX citation:
@mastersthesis{Chang:M01/23,
Author= {Chang, Runzi},
Title= {Full profile chemical mechanical polishing (CMP) metrology},
School= {EECS Department, University of California, Berkeley},
Year= {2001},
Month= {May},
Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html},
Number= {UCB/ERL M01/23},
}
EndNote citation:
%0 Thesis %A Chang, Runzi %T Full profile chemical mechanical polishing (CMP) metrology %I EECS Department, University of California, Berkeley %D 2001 %@ UCB/ERL M01/23 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html %F Chang:M01/23