Full profile chemical mechanical polishing (CMP) metrology
Runzi Chang
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M01/23
, 2001
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-23.pdf
BibTeX citation:
@mastersthesis{Chang:M01/23, Author= {Chang, Runzi}, Title= {Full profile chemical mechanical polishing (CMP) metrology}, School= {EECS Department, University of California, Berkeley}, Year= {2001}, Month= {May}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html}, Number= {UCB/ERL M01/23}, }
EndNote citation:
%0 Thesis %A Chang, Runzi %T Full profile chemical mechanical polishing (CMP) metrology %I EECS Department, University of California, Berkeley %D 2001 %@ UCB/ERL M01/23 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html %F Chang:M01/23