Full profile chemical mechanical polishing (CMP) metrology

Runzi Chang

EECS Department, University of California, Berkeley

Technical Report No. UCB/ERL M01/23

2001

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http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/Archive/ERL-01-23.pdf

BibTeX citation:

@mastersthesis{Chang:M01/23,
    Author= {Chang, Runzi},
    Title= {Full profile chemical mechanical polishing (CMP) metrology},
    School= {EECS Department, University of California, Berkeley},
    Year= {2001},
    Month= {May},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html},
    Number= {UCB/ERL M01/23},
}

EndNote citation:

%0 Thesis
%A Chang, Runzi 
%T Full profile chemical mechanical polishing (CMP) metrology
%I EECS Department, University of California, Berkeley
%D 2001
%@ UCB/ERL M01/23
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/9584.html
%F Chang:M01/23