Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices
Joanna Lai
EECS Department, University of California, Berkeley
Technical Report No. UCB/EECS-2008-173
December 19, 2008
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.pdf
Advisors: Tsu-Jae King Liu
BibTeX citation:
@phdthesis{Lai:EECS-2008-173, Author= {Lai, Joanna}, Title= {Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices}, School= {EECS Department, University of California, Berkeley}, Year= {2008}, Month= {Dec}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html}, Number= {UCB/EECS-2008-173}, }
EndNote citation:
%0 Thesis %A Lai, Joanna %T Novel Processes and Structures for Low Temperature Fabrication of Integrated Circuit Devices %I EECS Department, University of California, Berkeley %D 2008 %8 December 19 %@ UCB/EECS-2008-173 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2008/EECS-2008-173.html %F Lai:EECS-2008-173