Meriem Ben Salah Ep Akin

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2014-113

May 19, 2014

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.pdf

Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications, and offering a wide range of advantages. Taking planar one-dimensional flexible systems onto the next level of high-speed and high performance electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. microcontrollers, batteries, sensors, actuators etc., to flexible interconnects exist. In this work, a comprehensive surface mount technology (SMT) for rigid and silicon dioxide based ICs onto flexible and glycol-modified Polyethylene Terephthalate screen-printed interconnects is developed. Here, the SMT solution addresses the following challenges: low thermal budget of Polyethylene Terephthalate, non-solderability of the screen-printed structures, aluminum coating of the IC, and small-sized pitches of the IC. Besides, various reliability aspects of the assembled electrical end product are investigated.

Advisors: Ana Claudia Arias

---

BibTeX citation:

@mastersthesis{Ben Salah Ep Akin:EECS-2014-113,
    Author= {Ben Salah Ep Akin, Meriem},
    Editor= {Arias, Ana Claudia},
    Title= {A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects},
    School= {EECS Department, University of California, Berkeley},
    Year= {2014},
    Month= {May},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.html},
    Number= {UCB/EECS-2014-113},
    Abstract= {Mechanically flexible and one-dimensional electronic interconnects are nowadays a standard, enabling various applications, and offering a wide range of advantages. Taking planar one-dimensional flexible systems onto the next level of high-speed and high performance electronic systems, various efforts on connecting rigid integrated circuits (ICs), e.g. microcontrollers, batteries, sensors, actuators etc., to flexible interconnects exist. In this work, a comprehensive surface mount technology (SMT) for rigid and silicon dioxide based ICs onto flexible and glycol-modified Polyethylene Terephthalate screen-printed interconnects is developed. Here, the SMT solution addresses the following challenges: low thermal budget of Polyethylene Terephthalate, non-solderability of the screen-printed structures, aluminum coating of the IC, and small-sized pitches of the IC. Besides, various reliability aspects of the assembled electrical end product are investigated.},
}

EndNote citation:

%0 Thesis
%A Ben Salah Ep Akin, Meriem 
%E Arias, Ana Claudia 
%T A Comprehensive Surface Mount Technology Solution for Integrated Circuits onto Flexible Screen Printed Electrical Interconnects
%I EECS Department, University of California, Berkeley
%D 2014
%8 May 19
%@ UCB/EECS-2014-113
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2014/EECS-2014-113.html
%F Ben Salah Ep Akin:EECS-2014-113