Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability

Divya Kashyap

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2015-45
May 4, 2015

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.pdf

Advisor: Clark Nguyen


BibTeX citation:

@mastersthesis{Kashyap:EECS-2015-45,
    Author = {Kashyap, Divya},
    Title = {Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability},
    School = {EECS Department, University of California, Berkeley},
    Year = {2015},
    Month = {May},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html},
    Number = {UCB/EECS-2015-45}
}

EndNote citation:

%0 Thesis
%A Kashyap, Divya
%T Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability
%I EECS Department, University of California, Berkeley
%D 2015
%8 May 4
%@ UCB/EECS-2015-45
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html
%F Kashyap:EECS-2015-45