Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability
Divya Kashyap
EECS Department, University of California, Berkeley
Technical Report No. UCB/EECS-2015-45
May 4, 2015
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.pdf
Advisors: Clark Nguyen
BibTeX citation:
@mastersthesis{Kashyap:EECS-2015-45, Author= {Kashyap, Divya}, Title= {Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability}, School= {EECS Department, University of California, Berkeley}, Year= {2015}, Month= {May}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html}, Number= {UCB/EECS-2015-45}, }
EndNote citation:
%0 Thesis %A Kashyap, Divya %T Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability %I EECS Department, University of California, Berkeley %D 2015 %8 May 4 %@ UCB/EECS-2015-45 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html %F Kashyap:EECS-2015-45