Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability

Divya Kashyap

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2015-45

May 4, 2015

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http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/Archive/EECS-2015-45.pdf

Advisors: Clark Nguyen

BibTeX citation:

@mastersthesis{Kashyap:EECS-2015-45,
    Author= {Kashyap, Divya},
    Title= {Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability},
    School= {EECS Department, University of California, Berkeley},
    Year= {2015},
    Month= {May},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html},
    Number= {UCB/EECS-2015-45},
}

EndNote citation:

%0 Thesis
%A Kashyap, Divya 
%T Finite Element Analysis of the Effects of Package Induced Stress on Micromechanical Resonator Temperature Stability
%I EECS Department, University of California, Berkeley
%D 2015
%8 May 4
%@ UCB/EECS-2015-45
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2015/EECS-2015-45.html
%F Kashyap:EECS-2015-45