Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform

Sen Lin and Krishna Settaluri and Sajjad Moazeni

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2017-193

December 3, 2017

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http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/Archive/EECS-2017-193.pdf

Advisors: Vladimir Stojanovic

BibTeX citation:

@mastersthesis{Lin:EECS-2017-193,
    Author= {Lin, Sen and Settaluri, Krishna and Moazeni, Sajjad},
    Editor= {Stojanovic, Vladimir},
    Title= {Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform},
    School= {EECS Department, University of California, Berkeley},
    Year= {2017},
    Month= {Dec},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html},
    Number= {UCB/EECS-2017-193},
}

EndNote citation:

%0 Thesis
%A Lin, Sen 
%A Settaluri, Krishna 
%A Moazeni, Sajjad 
%E Stojanovic, Vladimir 
%T Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform
%I EECS Department, University of California, Berkeley
%D 2017
%8 December 3
%@ UCB/EECS-2017-193
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html
%F Lin:EECS-2017-193