Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform
Sen Lin and Krishna Settaluri and Sajjad Moazeni
EECS Department, University of California, Berkeley
Technical Report No. UCB/EECS-2017-193
December 3, 2017
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.pdf
Advisors: Vladimir Stojanovic
BibTeX citation:
@mastersthesis{Lin:EECS-2017-193, Author= {Lin, Sen and Settaluri, Krishna and Moazeni, Sajjad}, Editor= {Stojanovic, Vladimir}, Title= {Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform}, School= {EECS Department, University of California, Berkeley}, Year= {2017}, Month= {Dec}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html}, Number= {UCB/EECS-2017-193}, }
EndNote citation:
%0 Thesis %A Lin, Sen %A Settaluri, Krishna %A Moazeni, Sajjad %E Stojanovic, Vladimir %T Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform %I EECS Department, University of California, Berkeley %D 2017 %8 December 3 %@ UCB/EECS-2017-193 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html %F Lin:EECS-2017-193