Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform

Sen Lin, Krishna Settaluri and Sajjad Moazeni

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2017-193
December 3, 2017

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.pdf

Advisor: Vladimir Stojanovic


BibTeX citation:

@mastersthesis{Lin:EECS-2017-193,
    Author = {Lin, Sen and Settaluri, Krishna and Moazeni, Sajjad},
    Editor = {Stojanovic, Vladimir},
    Title = {Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform},
    School = {EECS Department, University of California, Berkeley},
    Year = {2017},
    Month = {Dec},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html},
    Number = {UCB/EECS-2017-193}
}

EndNote citation:

%0 Thesis
%A Lin, Sen
%A Settaluri, Krishna
%A Moazeni, Sajjad
%E Stojanovic, Vladimir
%T Demonstration of an Optical Chip-to-Chip Link in a 3D Integrated Electronic-Photonic Platform
%I EECS Department, University of California, Berkeley
%D 2017
%8 December 3
%@ UCB/EECS-2017-193
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2017/EECS-2017-193.html
%F Lin:EECS-2017-193