Benjamin Korpan

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2020-177

August 21, 2020

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.pdf

Advisors: Krste Asanović

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BibTeX citation:

@mastersthesis{Korpan:EECS-2020-177,
    Author= {Korpan, Benjamin},
    Title= {RingBOOM: An Implementation of a Novel High-Performance Banked Microarchitecture},
    School= {EECS Department, University of California, Berkeley},
    Year= {2020},
    Month= {Aug},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.html},
    Number= {UCB/EECS-2020-177},
}

EndNote citation:

%0 Thesis
%A Korpan, Benjamin 
%T RingBOOM: An Implementation of a Novel High-Performance Banked Microarchitecture
%I EECS Department, University of California, Berkeley
%D 2020
%8 August 21
%@ UCB/EECS-2020-177
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.html
%F Korpan:EECS-2020-177