RingBOOM: An Implementation of a Novel High-Performance Banked Microarchitecture

Benjamin Korpan

EECS Department
University of California, Berkeley
Technical Report No. UCB/EECS-2020-177
August 21, 2020

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.pdf

Advisor: Krste Asanović


BibTeX citation:

@mastersthesis{Korpan:EECS-2020-177,
    Author = {Korpan, Benjamin},
    Title = {RingBOOM: An Implementation of a Novel High-Performance Banked Microarchitecture},
    School = {EECS Department, University of California, Berkeley},
    Year = {2020},
    Month = {Aug},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.html},
    Number = {UCB/EECS-2020-177}
}

EndNote citation:

%0 Thesis
%A Korpan, Benjamin
%T RingBOOM: An Implementation of a Novel High-Performance Banked Microarchitecture
%I EECS Department, University of California, Berkeley
%D 2020
%8 August 21
%@ UCB/EECS-2020-177
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-177.html
%F Korpan:EECS-2020-177