Low Overhead Materialization with Flor

Eric Liu

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2020-79

May 28, 2020

This publication is archived. It is kept only for reference purposes, so it is no longer being updated and may not meet accessibility standards. If you need this content in a different format, please email webteam@eecs.berkeley.edu.

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/Archive/EECS-2020-79.pdf

Advisors: Joseph M. Hellerstein

BibTeX citation:

@mastersthesis{Liu:EECS-2020-79,
    Author= {Liu, Eric},
    Title= {Low Overhead Materialization with Flor},
    School= {EECS Department, University of California, Berkeley},
    Year= {2020},
    Month= {May},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-79.html},
    Number= {UCB/EECS-2020-79},
}

EndNote citation:

%0 Thesis
%A Liu, Eric 
%T Low Overhead Materialization with Flor
%I EECS Department, University of California, Berkeley
%D 2020
%8 May 28
%@ UCB/EECS-2020-79
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2020/EECS-2020-79.html
%F Liu:EECS-2020-79