Rami Hijab

EECS Department, University of California, Berkeley

Technical Report No. UCB/

May 1, 2024

http://www2.eecs.berkeley.edu/Pubs/TechRpts/Hold/402dbca45a6aa2d39972d086c1c9a068.pdf

Advisors: Ali Niknejad

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BibTeX citation:

@mastersthesis{Hijab:31573,
    Author= {Hijab, Rami},
    Title= {Wideband mm-Wave and sub-THz Chip-to-Package Interfaces in Low Cost Organic Substrates},
    School= {EECS Department, University of California, Berkeley},
    Year= {2024},
    Number= {UCB/},
}

EndNote citation:

%0 Thesis
%A Hijab, Rami 
%T Wideband mm-Wave and sub-THz Chip-to-Package Interfaces in Low Cost Organic Substrates
%I EECS Department, University of California, Berkeley
%D 2024
%8 May 1
%@ UCB/
%F Hijab:31573