Catalog Description: Integrated circuit device fabrication and surface micromachining technology. Thermal oxidation, ion implantation, impurity diffusion, film deposition, expitaxy, lithography, etching, contacts and interconnections, and process integration issues. Device design and mask layout, relation between physical structure and electrical/mechanical performance. MOS transistors and poly-Si surface microstructures will be fabricated in the laboratory and evaluated.
Units: 4
Prerequisites: PHYSICS 7B
Formats:
Fall: 3 hours of lecture and 3 hours of laboratory per week
Spring: 3 hours of lecture and 3 hours of laboratory per week
Grading basis: letter
Final exam status: Written final exam conducted during the scheduled final exam period
Class Schedule (Fall 2022):
MoWe 09:30-10:59, Cory 540AB –
Jeffrey BOKOR
Class Schedule (Spring 2023):
TuTh 08:00-09:29, Social Sciences Building 166 –
Ali Javey
Department Notes:
Course objectives: Process integration design of MOS and MEMS devices based on fabrication modules. To establish relationships between process parameters and device parameters. Implementation of fabrication and testing methodologies in laboratory.
Topics covered:
- Fabrication of monolithic integrated circuits and surface microstructures, with emphasis on silicon planar technology: consideration of mask layout, photolithography, thermal oxidation, ion implantation, dopant diffusion, film deposition, epitaxy, etching, contacts and interconnections, and process integration issues.
- Electrical properties of semiconductor materials and integrated circuit devices; characterization of diodes, capacitors and MOS transistors, including effects of parasitic elements. Mechanical properties of polycrystalline silicon and oxide films; characterization of surface microstructures to evaluate Young's modulus, residual stress and quality factor.
- Last two weeks of lectures are selected modules by the instructor on nanofabrication techniques, future trends, green manufacturing, and electronic products of current interest.
- A four-mask process will be carried out in the laboratory to fabricate functional semiconductor devices, simple IC circuits, and surface microstructures. The process and devices will be characterized by electrical or mechanical testing.
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