Semiconductor Wafer Bonding and Ion-Cut Layer Transfer

C. Yun

EECS Department
University of California, Berkeley
Technical Report No. UCB/ERL M01/5
December 2001

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-5.pdf

BibTeX citation:

@techreport{Yun:M01/5,
    Author = {Yun, C.},
    Title = {Semiconductor Wafer Bonding and Ion-Cut Layer Transfer},
    Institution = {EECS Department, University of California, Berkeley},
    Year = {2001},
    Month = {Dec},
    URL = {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html},
    Number = {UCB/ERL M01/5}
}

EndNote citation:

%0 Report
%A Yun, C.
%T Semiconductor Wafer Bonding and Ion-Cut Layer Transfer
%I EECS Department, University of California, Berkeley
%D 2001
%@ UCB/ERL M01/5
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html
%F Yun:M01/5