Semiconductor Wafer Bonding and Ion-Cut Layer Transfer
C. Yun
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M01/5
, 2001
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-5.pdf
BibTeX citation:
@techreport{Yun:M01/5, Author= {Yun, C.}, Title= {Semiconductor Wafer Bonding and Ion-Cut Layer Transfer}, Year= {2001}, Month= {Dec}, Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html}, Number= {UCB/ERL M01/5}, }
EndNote citation:
%0 Report %A Yun, C. %T Semiconductor Wafer Bonding and Ion-Cut Layer Transfer %I EECS Department, University of California, Berkeley %D 2001 %@ UCB/ERL M01/5 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html %F Yun:M01/5