Semiconductor Wafer Bonding and Ion-Cut Layer Transfer

C. Yun

EECS Department, University of California, Berkeley

Technical Report No. UCB/ERL M01/5

2001

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http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/Archive/ERL-01-5.pdf

BibTeX citation:

@techreport{Yun:M01/5,
    Author= {Yun, C.},
    Title= {Semiconductor Wafer Bonding and Ion-Cut Layer Transfer},
    Year= {2001},
    Month= {Dec},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html},
    Number= {UCB/ERL M01/5},
}

EndNote citation:

%0 Report
%A Yun, C. 
%T Semiconductor Wafer Bonding and Ion-Cut Layer Transfer
%I EECS Department, University of California, Berkeley
%D 2001
%@ UCB/ERL M01/5
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html
%F Yun:M01/5