Semiconductor Wafer Bonding and Ion-Cut Layer Transfer
C. Yun
EECS Department, University of California, Berkeley
Technical Report No. UCB/ERL M01/5
2001
http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/ERL-01-5.pdf
BibTeX citation:
@techreport{Yun:M01/5,
Author= {Yun, C.},
Title= {Semiconductor Wafer Bonding and Ion-Cut Layer Transfer},
Year= {2001},
Month= {Dec},
Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html},
Number= {UCB/ERL M01/5},
}
EndNote citation:
%0 Report %A Yun, C. %T Semiconductor Wafer Bonding and Ion-Cut Layer Transfer %I EECS Department, University of California, Berkeley %D 2001 %@ UCB/ERL M01/5 %U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2001/3940.html %F Yun:M01/5