Dillon Acker-James

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2023-1

January 9, 2023

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2023/EECS-2023-1.pdf

Creating a wireless tactile actuator the size of an aspirin will allow for more precise physical stimulation. This will lead to a more immersive virtual reality (VR) experience and better convey information via touch. Making this wireless tactile actuator can be accomplished by further utilizing the existing Si on Insulator (SOI) structure. Currently, a printed circuit board (PCB) is used for the sole purpose of assembly, however, further utilization of the Micro Electromechanical Systems (MEMS) SOI structure can allow the chip to operate as both the actuator and housing package. In addition, the MEMS Si could replace circuitry previously incorporated in eternal components: lateral relays replacing high voltage buffers. The assembly of electronics into a MEMS housing was found to require finer assembly tools, lateral SOI relays to control the MEMS devices showed a need for a more durable contact material, and fabrication methods to enhance MEMS robustness are presented. These are meant to enable a durable aspirin-sized package to controllably stimulate the human skin.

Advisors: Kristofer Pister

---

BibTeX citation:

@mastersthesis{Acker-James:EECS-2023-1,
    Author= {Acker-James, Dillon},
    Title= {PCB-less Integration of a Robust Wireless MEMS Tactile Package},
    School= {EECS Department, University of California, Berkeley},
    Year= {2023},
    Month= {Jan},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2023/EECS-2023-1.html},
    Number= {UCB/EECS-2023-1},
    Abstract= {Creating a wireless tactile actuator the size of an aspirin will allow for more precise physical
stimulation. This will lead to a more immersive virtual reality (VR) experience and better
convey information via touch. Making this wireless tactile actuator can be accomplished by
further utilizing the existing Si on Insulator (SOI) structure. Currently, a printed circuit
board (PCB) is used for the sole purpose of assembly, however, further utilization of the
Micro Electromechanical Systems (MEMS) SOI structure can allow the chip to operate as
both the actuator and housing package. In addition, the MEMS Si could replace circuitry
previously incorporated in eternal components: lateral relays replacing high voltage buffers.
The assembly of electronics into a MEMS housing was found to require finer assembly tools,
lateral SOI relays to control the MEMS devices showed a need for a more durable contact
material, and fabrication methods to enhance MEMS robustness are presented. These are
meant to enable a durable aspirin-sized package to controllably stimulate the human skin.},
}

EndNote citation:

%0 Thesis
%A Acker-James, Dillon 
%T PCB-less Integration of a Robust Wireless MEMS Tactile Package
%I EECS Department, University of California, Berkeley
%D 2023
%8 January 9
%@ UCB/EECS-2023-1
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2023/EECS-2023-1.html
%F Acker-James:EECS-2023-1