Rami Hijab

EECS Department, University of California, Berkeley

Technical Report No. UCB/EECS-2025-40

December 1, 2025

http://www2.eecs.berkeley.edu/Pubs/TechRpts/2025/EECS-2025-40.pdf

The transition from transceiver, on integrated-circuit (IC), to antenna, on package or printed circuit board (PCB), is critical for future broadband communication systems that plan to operate in the mm-Wave or sub-THz frequency bands. To date, reported chip-to-package transitions either have high loss, typically 3−4 dB, or require high cost packages to support low loss materials or very fine bump pitches. This work analyzes the impact of transitions on a high frequency, wide bandwidth communication system. The theory, analysis and design of a chip-to-package transition in a commerical CMOS and organic substrate technology is presented. The developed theory and design principles are validated through the measurement of another chip-to-package transition, demonstrating ≤1 dB loss over a large bandwidth. Despite using large dimensions typical of low cost packaging or PCB solutions, the proposed and demonstrated transitions offer competitive performance.

Advisors: Ali Niknejad

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BibTeX citation:

@mastersthesis{Hijab:EECS-2025-40,
    Author= {Hijab, Rami},
    Title= {Wideband mm-Wave and sub-THz Chip-to-Package Interfaces in Low Cost Organic Substrates},
    School= {EECS Department, University of California, Berkeley},
    Year= {2025},
    Month= {May},
    Url= {http://www2.eecs.berkeley.edu/Pubs/TechRpts/2025/EECS-2025-40.html},
    Number= {UCB/EECS-2025-40},
    Abstract= {The transition from transceiver, on integrated-circuit (IC), to antenna, on package or printed circuit board (PCB), is critical for future broadband communication systems that plan to operate in the mm-Wave or sub-THz frequency bands. To date, reported chip-to-package transitions either have high loss, typically 3−4 dB, or require high cost packages to support low loss materials or very fine bump pitches. This work analyzes the impact of transitions on a high frequency, wide bandwidth communication system. The theory, analysis and design of a chip-to-package transition in a commerical CMOS and organic substrate technology is presented. The developed theory and design principles are validated through the measurement of another chip-to-package transition, demonstrating ≤1 dB loss over a large bandwidth. Despite using large dimensions typical of low cost packaging or PCB solutions, the proposed
and demonstrated transitions offer competitive performance.},
}

EndNote citation:

%0 Thesis
%A Hijab, Rami 
%T Wideband mm-Wave and sub-THz Chip-to-Package Interfaces in Low Cost Organic Substrates
%I EECS Department, University of California, Berkeley
%D 2025
%8 December 1
%@ UCB/EECS-2025-40
%U http://www2.eecs.berkeley.edu/Pubs/TechRpts/2025/EECS-2025-40.html
%F Hijab:EECS-2025-40